 |
| ¡@ |
| ¡@ |
 |
¡@Cleaning Procedure |
|
| ¡@ |
|
¡@ |
H2SO4 + H2O2 |
¡@ |
Remove Heavy Organic, Metal
H2SO4 + H2O2 -> H2SO5 + H2O
H2SO5 + Hydro Carbon -> CO2 + H2O + H2 |
¡@ |
MEGASONIC (950 KHz) |
¡@ |
Remove Organic, I/II side of Metal.Particle
2H2O2 + C -> CO2 + 2H2O
M + H2O2 -> MO + H2O
MO + 4NH4OH -> M(NH4)4+ |
¡@ |
Spin Dry |
|
|
| ¡@ |
|
¡@Remove the Particle by SC-1 |
|
| ¡@ |
|
|
1. Surface Oxidation by H2O2 |
|
2. Surface Etching and Particle Lift-off by NH4OH |
|
3. Electrical Repulsion by Surface Charge in Alkaline Solution (-OH)
The particles are separated and repelled from the mask surface simultaneously under the SC1 solusion.
|
|
|
| ¡@ |
|
