×

Warning

Error loading component: com_tags, Component not found.

Slit Mask

slitmask1

  

After vacuum evaporate on the glass, then utilize the gate metal to form the gate pattern, etch    gate metal to form gate electrode.


PR coating after vacuum evaporate active layer & source-drain layer.

 

 slitmask2

 

After exposure the light through mask and remove the PR, then about 25% PR still remain in the slit area. 

 

 slitmask3

 

Wet Etching Source-Drain Layer.

 

 slitmask4

 

Dry Etching Active Layer.

 

 slitmask5

 

Remove the remained PR in the slit area by ashing process, wet etching source-drain layer.

 

 slitmask6

 

Dry Etching N+ Layer.

 

 slitmask7

 

Completely remove PR and form TFT.

 

  slitmask8